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Semiconductor & Electronics

The production of an IC chip requires highly specialized equipment that operates under a variety of challenging environments such as:        

  • Plasma under vacuum
  • Elevated  temperature
  • Contact with highly abrasive solutiuons
  • Exposure to a variety of very aggressive chemicals

Mitsubishi Chemical Advanced Materials Engineering Plastic Products has developed materials that meet the strictest requirements for low contamination consistent wafer manuafacturing, yet with a focus on delivering low-cost solutions vs traditional materials such as quartz and ceramics.  Mitsubishi Chemical Advanced Materials materials are designed to be used throughout the wafer production process.

Your Advantages

  • Copy exact materials available anywhere on the globe
  • Extensive material selection, engineering support and testing capabilities
  • Machining capability to support quick turn NPI application development
  • The most extensive portfolio of materials specifically designed for use in Wet Process Tools
  • The global leader in manufacturing the materials used for CMP ring applications including Techtron® PPS, the global standard for CMP applications
  • Materials designed to deliver cost and performance for Dry Process Tools such as Etch, CVD and Ion Implant

Materials & Applications

  • CMP rings
  • Etch and CVD chamber applications
  • Wafer handling applications
  • Wet Process structural applications
  • Wet Process components     
  • Linings of storage containers for HP chemicals and water                                  

Injection Molding

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Back End Testing

Mitsubishi Chemical Advanced Materials EPP offers materials that can be specifically selected to meet the unique needs of any socket application.

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